On Sunday, the foundation stone for India's first advanced 3D chip packaging unit was laid at Info Valley in Bhubaneswar, Odisha. This initiative is a pivotal step towards enhancing India's semiconductor ecosystem and aligns with the Atmanirbhar Bharat vision for self-reliance in electronics manufacturing. Union Minister for Electronics & IT Ashwini Vaishnaw emphasized the importance of this project during the Akshay Tritiya festival, expressing gratitude to Prime Minister Narendra Modi and Odisha Chief Minister Mohan Charan Majhi. The facility will implement advanced 3D glass substrate technology, a significant innovation in semiconductor manufacturing, moving away from traditional silicone substrates. The project, which involves an investment of nearly ₹2,000 crore (approximately $240 million USD), aims to produce 70,000 glass panels annually, alongside 50 million assembled units and 13,000 advanced 3DHI modules. Chief Minister Majhi described the establishment of this plant as a historic milestone for both Odisha and the nation, noting the involvement of global tech leaders like Intel and Lockheed Martin. The project is expected to generate over 2,500 jobs, reinforcing Odisha's position as a hub for advanced semiconductor technology.