On Sunday, Odisha Chief Minister Mohan Charan Majhi inaugurated the foundation stone for 3D Glass Solutions Inc.’s advanced chip packaging unit in Info Valley, Bhubaneswar. Union Electronics and IT Minister Ashwini Vaishnaw attended the ceremony, calling it a 'historic day' for the state. The new facility will introduce cutting-edge technologies and is part of a broader push by the Indian government to establish a self-reliant semiconductor ecosystem. The Centre had previously approved semiconductor manufacturing units in Odisha, including a facility by SiCSem Private Limited, which will focus on Silicon Carbide devices. Collectively, these projects are expected to generate over 2,000 skilled jobs and significantly contribute to sectors such as defence, electric vehicles, and renewable energy. With cumulative investments exceeding ₹1.6 lakh crore (approximately $192 billion USD), Odisha is poised to enhance its status as an IT and electronics manufacturing hub.